Power Supplies (LDO, Buck, Boost)
Every board needs to turn its input voltage into clean rails. The two families are linear (LDO) and switching (buck/boost) β pick per rail, then lay each out correctly.
Choosing a regulatorβ
| Type | Efficiency | Noise | Complexity | Use when |
|---|---|---|---|---|
| LDO (linear) | Low (drops V as heat) | Very low | Tiny | Small drop, low current, noise-sensitive (RF, ADC, clocks) |
| Buck (step-down) | High | Switching ripple | Medium | Big drop or higher current (e.g. 12 V β 3.3 V) |
| Boost (step-up) | High | Switching ripple | Medium | Output above input (e.g. battery β 5 V) |
A common pattern: buck for the bulk drop, then a small LDO to clean a sensitive rail.
LDO layoutβ
- Input and output capacitors right at the pins; respect the datasheet's required cap type and value (stability depends on it).
- It dissipates
(Vin β Vout) Γ Ias heat β add copper pour / thermal vias for higher current.
Buck layout (the part people get wrong)β
- Keep the hot loop (input cap β high-side switch β low-side switch β back to cap) as small as possible β this loop radiates noise.
- Input cap close to the IC; inductor close; feedback trace away from the switch node and inductor (it's sensitive).
- Solid ground under the regulator; stitch with vias.
Protection & sequencingβ
- Reverse-polarity protection (series FET or diode) on the input.
- Fuse / PTC and a TVS for transient/ESD on exposed inputs.
- If rails must come up in order, plan power sequencing (enable pins, supervisors).
Heat & ripple
LDOs fail by overheating β always do the power-dissipation math. Bucks fail by noise β a big hot loop or misplaced feedback shows up as ripple and EMI.
See alsoβ
- Power Electronics & High-Current
- Building a Product β supporting chips (LDO, etc.)
- Common Mistakes & Risks